Angel Tax Incentive — Securities Commission / MOF
Open & ActiveTax Incentive
- Tenure
- Minimum 2-year investment hold period
IC Design & Embedded SystemsAdvanced Materials & SubstratesEquipment Manufacturing / Automation
Bank Negara Malaysia (BNM) — SME Stabilisation Relief Facility (SME SRF)
Open & ActiveSoft Loan
- Tenure
- Up to 5 years
Advanced Materials & Substrates
BPMB — Semiconductor Financing Programme (NSS-linked)
Open & ActiveSoft Loan
- Tenure
- 7–15 years (medium-to-long term project financing)
IC Design & Embedded SystemsFabrication / FoundryAdvanced Packaging / OSAT+1 more
Cradle Fund — CIP SPARK (Pre-Commercialisation Grant)
Open & ActiveGrant
- Tenure
- Up to 18 months
IC Design & Embedded SystemsAdvanced Materials & SubstratesEquipment Manufacturing / Automation
Cradle Fund — CIP SPRINT (Commercialisation Grant)
Open & ActiveGrant
- Tenure
- Up to 18 months
IC Design & Embedded SystemsAdvanced Packaging / OSATEquipment Manufacturing / Automation
Khazanah — Dana Impak: Semiconductor & Advanced Mfg
Active but limitedEquity / Private Equity
- Tenure
- 5–10 year investment horizon
IC Design & Embedded SystemsFabrication / FoundryAdvanced Packaging / OSAT+1 more
Khazanah — Jelawang Capital (National Fund-of-Funds / NFOF)
Open & ActiveVenture Capital
- Tenure
- 10–12 years (fund-of-funds lifecycle)
IC Design & Embedded SystemsAdvanced Materials & SubstratesEquipment Manufacturing / Automation
KMP — Deep Tech / E&E Fund (Kumpulan Modal Perdana)
Open & ActiveVenture Capital
- Tenure
- Typical VC holding period: 5–8 years
IC Design & Embedded SystemsICT / Deep TechGreen / Renewable Energy
KWAP — Dana Pemacu (Co-GP / Catalyst Fund)
Active but indirectEquity / Private Equity
- Tenure
- Typical PE fund: 5–7 years (10–12 year fund life)
IC Design & Embedded SystemsAdvanced Packaging / OSATEquipment Manufacturing / Automation
KWAP — Dana Perintis (VC Early-Stage Fund)
Active but indirectVenture Capital
- Tenure
- 7–10 years (venture investment horizon)
IC Design & Embedded SystemsAdvanced Materials & SubstratesEquipment Manufacturing / Automation
MDEC — Malaysia Digital Catalyst Grant (MDCG) / Digital Acceleration Grant (MDAG)
Open & ActiveGrant
- Tenure
- Up to 12 months per project
IC Design & Embedded SystemsSmart Factory / Industry 4.0
MDV — Venture Debt Financing (Malaysia Debt Ventures)
Active but limitedVenture Debt
- Tenure
- Typical 2–5 years (venture debt tenor aligned to equity round runway)
ICT / Deep TechGreen / Renewable EnergyIC Design & Embedded Systems+1 more
MIDA — Outcome-Based Incentive Framework (NIIF)
Active but limitedTax Incentive
- Tenure
- Outcome measurement: typically 3–5 years; incentive claim period following
IC Design & Embedded SystemsFabrication / FoundryAdvanced Packaging / OSAT+1 more
MIDF — Aerospace & Electrical & Electronic Investment Fund (AEEIF)
Open & ActiveGrant
- Tenure
- Project completion within 12 months from date of approval; disbursement follows project milestones
IC Design & Embedded SystemsAdvanced Packaging / OSATEquipment Manufacturing / Automation+1 more
MIDF — Soft Financing Scheme for Automation & Modernisation (SFSAM)
Open & ActiveSoft Loan
- Tenure
- Up to 25 years (commercial property); up to 10 years (machinery & equipment, IT hardware/software, commercial vehicles); up to 7 years (working capital, export enhancement)
Advanced Packaging / OSATEquipment Manufacturing / AutomationFabrication / Foundry+1 more
MOSTI — Technology Development Fund (TeD1 / TeD2) — PEMACU
Open & ActiveGrant
- Tenure
- TeD1: up to 24 months; TeD2: up to 36 months
IC Design & Embedded SystemsAdvanced Packaging / OSATAdvanced Materials & Substrates+1 more
MTDC — SemiconStart Malaysia (with Silicon Catalyst UK)
Open & ActiveIncubator / Accelerator
- Tenure
- Cohort-based: 12–18 months per cohort
IC Design & Embedded SystemsAdvanced Materials & SubstratesEquipment Manufacturing / Automation
SC Malaysia — Equity Crowdfunding (ECF) Platforms
Open & ActiveEquity Crowdfunding (ECF)
- Tenure
- Equity: no fixed tenure; investor hold until exit (acquisition/IPO); typically 3–7 years
IC Design & Embedded SystemsAdvanced Packaging / OSATEquipment Manufacturing / Automation+1 more
SC Malaysia — Peer-to-Peer (P2P) Financing Platforms
Open & ActiveP2P / Debt Financing
- Tenure
- 6–36 months (working capital); up to 5 years (term financing)
Advanced Packaging / OSATEquipment Manufacturing / AutomationAdvanced Materials & Substrates
Strategic Co-Investment Fund (CoSIF) — MOF / SC Malaysia
Open & ActiveGrant
- Tenure
- Project-based; underlying ECF/P2P tenure
Advanced Packaging / OSATEquipment Manufacturing / AutomationIC Design & Embedded Systems